+31 35 632 1751 info@ots-eu.com

Transient thermal behavior of a Power MOSFET

Home » Electronics cooling » Literature » Transient thermal behavior of a Power MOSFET

This article discusses the influence of transient behavior of a semiconductor on the selection of your thermal solution. Also it shows the necessity of this study in order to get the correct selection of both heat sink and interface material. A selection that is based on average power will lead to wrong choices and insufficient cooling, without you being aware of this fact. An application in which a MOSFET is fitted onto a heat sink has been evaluated for steady state and transient behavior. This article discusses the advantages of the use of network analyses in order to obtain the most optimal thermal solution.

Please click on the link below to read the complete report in English.

White paper Transient thermal behavior of a Power MOSFET

 

Back to Literature

Reach Us

You can contact us at:

De Nieuwe Vaart 50
1401 GS Bussum
The Netherlands

+31 35 632 1751

54695872 (Chamber
of Commerce)
info@ots-eu.com

Questions? Leave A Message